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1. Provide system design, hardware selection, software design guidance, and debugging support according to the needs of customers.
2. Review customer schematics and PCB designs to ensure accuracy.
3. Conduct on-site fault diagnosis and troubleshooting for chip-related issues and produce analysis reports.
4. Provide technical support to users and internal marketing personnel, and regularly organize product training sessions.
5. Maintain good communication with marketing and R&D personnel to assist in updating the company's product lines.
6. Keep good communication with the customer's R&D personnel to deeply understand customer needs.
7. Regularly analyze post-sale product quality issues, form summary reports, and improve product stability and quality.

1. Full-time undergraduate degree or above; major in software, electronics, communication, or other engineering disciplines; English proficiency at CET-4 level or above.
2. Ability to read schematics and check customer drawings against design requirements.
3. Proficiency in using oscilloscopes to analyze signal waveforms.
4. Proficiency in using logic analyzers to capture and analyze boot sequences and configurations, and to troubleshoot issues.
5. Ability to read customer chip initialization code and guide customers in modifying it.
6. Preference for candidates with more than 3 years of experience in the automotive electronics industry (such as in-car cameras, displays, navigation systems, panoramic systems, etc.).
7. Outgoing personality and good communication skills.
8. Ability to adapt to business travel.

1. Rsemi Technology, No. 12, 12th Floor, Building E6-1, Tianfu Software Park, No. 1366, Middle Section of Tianfu Avenue, High-tech Zone, Chengdu, Sichuan Province.
2. Rsemi Technology, 4th Floor, Building 27, Baijia Tong, No. 388, Shengrong Road, Zhangjiang Town, Pudong New Area, Shanghai.

1. Collaborate with backend and system teams from a packaging perspective to evaluate and optimize floorplan, bumpmap, and ballmap.
2. Be responsible for the evaluation of product packaging solutions, providing competitive designs from the perspectives of cost, reliability, and area.
3. Handle the packaging design, collaborate with suppliers for communication to complete packaging design, and work on drawing and checking drawings.
4. Participate in the establishment, maintenance, and updating of the packaging design process.

1. Bachelor's degree or above, with two or more years of experience in packaging design.
2. Proficient in packaging design software and tools such as FCCSP/QFN, with the ability to independently complete packaging design.
3. Familiar with packaging processes and the production and processing flow of substrates.
4. Preference for candidates with the ability to perform thermal simulation for packaging.

1. Rsemi Technology, No. 12, 12th Floor, Building E6-1, Tianfu Software Park, No. 1366, Middle Section of Tianfu Avenue, High-tech Zone, Chengdu, Sichuan Province.
2. Rsemi Technology, 4th Floor, Building 27, Baijia Tong, No. 388, Shengrong Road, Zhangjiang Town, Pudong New Area, Shanghai.

1. Responsible for the backend design and physical implementation of digital chips, including synthesis, timing analysis, physical verification, and power analysis.
2. In charge of formulating the backend design process and plan for digital chips.
3. Responsible for technical reviews related to backend implementation and writing relevant user manuals.
4. Produce detailed design and implementation documents.

1. Master's degree or above with at least 3 years of experience in digital backend work, or a bachelor's degree with 5 years or more experience, with at least one successful tape-out experience.
2. Proficient in the backend implementation process of digital chips; familiar with the relevant knowledge of integrated circuit manufacturing processes; familiar with the principles and design of logic/timing circuits; proficient in SDC timing STA analysis; proficient in using EDA design verification tools such as DC, PT, LINT, and Formality.
3. Familiar with scripting languages such as Perl and Tcl.
4. Preference for candidates with experience in DFT (Design for Testability) design.

1. Rsemi Technology, No. 12, 12th Floor, Building E6-1, Tianfu Software Park, No. 1366, Middle Section of Tianfu Avenue, High-tech Zone, Chengdu, Sichuan Province.
2. Rsemi Technology, 4th Floor, Building 27, Baijia Tong, No. 388, Shengrong Road, Zhangjiang Town, Pudong New Area, Shanghai.

1. Write verification documents as required and under guidance.
2. Set up the unit testing (UT) environment.
3. Develop and debug test cases and functional coverage points.
4. Debug and work with design engineers to fix bugs.
5. Provide technical support to other teams.

1. Bachelor's degree or above in an electronics-related field.
2. Experience in digital chip verification, proficient in SystemVerilog language, familiar with common EDA tools.
3. Understanding of UVM (Universal Verification Methodology) verification methods.
4. Knowledge of C/C++, familiar with at least one of the following scripting languages: TCL, Perl, Python.

1. Rsemi Technology, No. 12, 12th Floor, Building E6-1, Tianfu Software Park, No. 1366, Middle Section of Tianfu Avenue, High-tech Zone, Chengdu, Sichuan Province.
2. Rsemi Technology, 4th Floor, Building 27, Baijia Tong, No. 388, Shengrong Road, Zhangjiang Town, Pudong New Area, Shanghai.

1.In accordance with the product definition, complete the collection of digital module requirements and write the design documentation;
2.Engage in digital front-end design and development work, including RTL design, module verification, synthesis, and timing convergence;
3.Design FPGA prototypes and collaborate on testing and debugging;
4.Provide technical support to other departments.

1. Bachelor's degree or above in an electronics-related field;
2. Over 3 years of experience in digital chip design, proficient in Verilog language, familiar with common EDA tools;
3. Familiar with digital front-end design methods such as logic design, logic synthesis, and timing convergence;
4. Familiar with interfaces such as I2C, SPI, knowledgeable in ARM systems and AMBA buses, and understanding of MIPI-related protocol standards;
5. Experience with DesignWare or ARM IP;
6. Preference for candidates with experience in mixed-signal chip projects; candidates with project tape-out experience are preferred.

1. Rsemi Technology, No. 12, 12th Floor, Building E6-1, Tianfu Software Park, No. 1366, Middle Section of Tianfu Avenue, High-tech Zone, Chengdu, Sichuan Province.
2. Rsemi Technology, 4th Floor, Building 27, Baijia Tong, No. 388, Shengrong Road, Zhangjiang Town, Pudong New Area, Shanghai.